MIL-DTL-55302/32G
REQUIREMENTS:
Design and construction:
Dimensions and configuration: See figure 1.
Material: Contact material shall be in accordance with MIL-DTL-55302 or beryllium copper alloy C17410 in
accordance with ASTM B768.
Plating (contact):
Engagement area: Gold over .100 inch (2.54 mm) length over nickel in accordance with MIL-DTL-55302.
Termination area: Tin lead for .220 inch (5.59 mm) length over nickel in accordance with MIL-DTL-55302.
Other areas: Nickel-plated in accordance with MIL-DTL-55302.
PINs M55302/32-02 through M55302/32-07: Entire part shall be plated with gold over nickel in accordance
with MIL-DTL-55302.
Qualification and quality conformance: Qualification and quality conformance requirements are not applicable. All
contacts are tested in accordance with the applicable specification sheet.
Supersession data: See table I.
TABLE I. Supersession data.
Superseding PIN
Superseded manufacturer's
M55302/32-
(CAGE 00779)
PIN
01
583218-3
02
2-583812-6
03
2-583812-8
04
3-583812-0
05
1-446629-4
06
1-446629-6
07
1-446629-8
Application: Contacts, solder eyelet, are to be used with connectors in accordance with MIL-DTL-55302/24,
MIL-DTL-55302/25, and MIL-DTL-55302/27, (type II). Contacts, wrappost, are to be used with connectors in
accordance with MIL-DTL-55302/27 (types V and VI) and MIL-DTL-55302/130 (type 2).
Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the
extent of the changes.
Referenced documents. In addition to MIL-DTL-55302, this document references the following:
MIL-DTL-55302/130
MIL-DTL-55302/24
MIL-I-81969/9
MIL-DTL-55302/25
ASTM B768
MIL-DTL-55302/27
3
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