MIL-DTL-83538D
6.11 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may
exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to
years after manufacture and can develop under typical operating conditions, on products that use such
materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation
of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For
additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited
Coatings of Tin) (see 3.43).
LAUNCHER CONNECTOR
FWD
UMBILICAL, RECEPTACLE
BUFFER CONNECTOR
UMBILICAL PLUG
STORE CONNECTOR
UMBILICAL RECEPTACLE
FWD
FIGURE 1. Electrical umbilical assembly.
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