MIL-DTL-55302/24G
REQUIREMENTS:
Design and construction:
Dimensions and configuration: See figure 1.
Material:
Insulator body: Insulator material shall be in accordance with MIL-DTL-55302 or type GLCP-30F in
accordance with ASTM D5138 or MIL-M-24519.
Contact material: Contact material in accordance with MIL-DTL-55302 or beryllium copper alloy C17400 in
accordance with ASTM B768.
Plating:
Engagement area: Gold in accordance MIL-DTL-55302 for .100 length, over nickel all over in accordance
with MIL-DTL-55302.
Termination area: Tin lead over nickel in accordance with MIL-DTL-55302 for the lengths:
.165 minimum length for type I, .200 minimum length for type II.
.300 minimum length for type III, .140 minimum length for type IV.
Contact identification: See figure 1.
Contact rating: 3.0 amperes maximum per contact, 2.25 amperes continuous per contact at 75º F.
Keying: See MIL-DTL-55302/31.
Oversized pin exclusions (sockets only): .0465 diameter pin.
Contact separation force: The connector shall meet the requirements of MIL-DTL-55302/29.
Wire size: Number 26 AWG maximum with type II, solder eyelet contact for wire termination.
Resistance to test probe damage: The connector shall meet the requirements of MIL-DTL-55302/30.
Mating and unmating: The maximum mating force in pounds shall be the number of contacts multiplied by .25
and the withdrawal force in pounds shall be a minimum of .025 times the number of contacts and shall not
exceed the measured insertion force.
Contact resistance: The average contact resistance of all contact measured shall not exceed .015 ohm, and no
individual contact pair shall have a resistance exceeding .020 ohm.
Contact retention: 3 pounds minimum.
Dielectric withstanding voltage:
Sea level: 900 volts rms.
High altitude: 200 volts rms.
Replacement contacts: See MIL-DTL-55302/32.
Contact removal tool: MIL-I-81969/9-01.
Part or Identifying Number (PIN): M55302/24-(dash number from figure 1).
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