MIL-DTL-28731F
4.7.13.1 Crimp tensile strength (adapter to crimp contact) (see 3.6.13). Provisions shall be made for
mounting contacts in a suitable position of applying gradually increased loads during separation of the
adapter and contact. Samples for test shall be placed in a standard tensile testing machine and the load
applied at an approximate rate of 1 inch (25.4 mm) per minute to pull the adapter out of the contact.
4.7.14 Contact separating forces (contacts) (see 3.6.14). Provisions shall be made for mounting
contacts in a suitable position of applying gradually increased loads during separation of the contact. The
depth of the engagement shall be equal to the maximum length of the contact for the mating connector.
4.7.14.1 Contact separating forces (unplated contacts) (see 3.1). Separating forces of contacts when
measured with the gauge shown on figure 6 shall be as specified.
4.7.14.2 Contact separating forces (plated contacts) (see 3.1). Separating forces of contacts when
mated to each other shall be as specified.
4.7.15 Low level circuit resistance (contacts) (see 3.6.15). The low level circuit test shall be performed
in accordance with test procedure EIA-364-23. For adapter to crimp contacts, figure 7 shall be used.
4.7.16 Resistance to soldering heat (see 3.6.16). All connectors with solder terminations shall be
tested in accordance with MIL-STD-202, method 208 the following details shall apply:
a. The applicable wire size properly prepared shall be inserted into the contact termination. A
minimum of seven contacts shall be tested.
b. An appropriately prepared resistance soldering iron with an appropriate tip shall be applied to the
lower portion of the terminal configuration where the wire enters the termination.
c. The solder shall be applied in the normal manner.
d. The resistance soldering iron shall be applied to the system. The wattage shall be adjusted as to
allow a proper solder fillet to be formed, or for a 4 second minimum time limit, whichever is more.
e. After application, the soldering iron shall be removed and a visual and mechanical inspection
performed.
f. Visual inspection shall be a 1X, magnification. The connector shall show no evidence of distortion
or damage to any area of the connector housing. The contact shall meet the contact retention
requirements (see 4.7.5). The contact shall not interface with normal floating conditions as
applicable and shall meet applicable location dimensions.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor
personnel, these personnel need to contact the responsible packaging activity to ascertain packaging
requirements. Packaging requirements are maintained by the Inventory Control Point's packaging
activities within the Military Service or Defense Agency, or within the Military Service's system commands.
Packaging data retrieval is available from the managing Military Department's or Defense Agency's
automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
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