MIL-DTL-55302/156E
REQUIREMENTS
Design and construction:
Dimensions and configuration: See figures 1 and 2 and table I.
Material:
Insulator body: Insulator material shall be in accordance with MIL-DTL-55302 or type GLCP-30F in
accordance with ASTM D5138 or MIL-M-24519.
Contact material: Contact material in accordance with MIL-DTL-55302 or Beryllium copper alloy
C17400 in accordance with ASTM B768.
Plating: The contact plating for the engagement area, (.150 inch minimum length) shall be gold in
accordance with MIL-DTL-55302 over nickel in accordance with MIL-DTL-55302. The contact area
between the engagement area and the solder tail shall be nickel accordance MIL-DTL-55302. The
contact plating for the solder tail area shall be tin-lead over nickel in accordance with MIL-DTL-55302.
Contact identification: See figures 1 and 2.
Contact rating: 3.0 amperes maximum per contact, 2.25 amperes continuous per contact at 75ºF.
Mating and unmating: The maximum mating force in pounds shall the number of contacts multiplied by
.25 and the withdrawal force in pounds shall be a minimum of .025 times the number of contacts and
shall not exceed the measured insertion force.
Contact resistance: No individual contact pair shall have a resistance exceeding .020 ohm.
Contact retention: 3 pounds minimum.
Dielectric withstanding voltage:
Sea level: 900 volts rms.
High altitude: 200 volts rms.
Keying: See MIL-DTL-55302/31.
Part or Identifying Number (PIN): M55302/156-(and dash number from table I).
Patent number 3,404,367. The Government has a royalty free license under this patent for the benefit of
manufacturers of the item either for the Government or for use in equipment to be delivered to the
Government.
Changes from previous issue. Marginal notations are not used in this revision to identify changes with
respect to the previous issue due to the extent of the changes.
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