MIL-DTL-22992G
6.8 Guidance on use of alternative parts with less hazardous or nonhazardous materials. This
specification provides for a number of alternative plating materials via the PIN. Users should select the
PIN with the least hazardous material that meets the form, fit and function requirements of their
application.
6.9 Subject term (keyword) listing.
Accessories
Control circuits
Dummy stowage
Electronic
Multi-contact
Power
6.10 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may
exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to
years after manufacture and can develop under typical operating conditions, on products that use such
materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation
of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For
additional information on this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coatings of Tin) (see 3.3.10).
6.11 Changes from previous issue. Marginal notations are not used in this revision to identify
changes with respect to the previous issue, due to the extensiveness of the changes.
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