8 inch printed wiring boards, and for interconnections between printed wiring boards. The connectors are intended to provide a reliable connection between printed wiring and conventional wiring. The interconnector concept is intended to provide connection of printed wiring on one board to printed wiring on another board.

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MIL-DTL-21097G

FIGURE 1. Contact mating area - Continued.

3.3.7.1.2.2 Terminations.

a. Solder termination areas shall be tin-lead plated in accordance with SAE-AMS-P-81728, .0001 inch minimum. The

tin content for class b shall be 50 to 70 percent. For classes A or C, and type CS, the tin content shall be 50 to 95

percent.

b. Crimp termination (class C) areas shall be gold plated in accordance with ASTM B488 type II, class 1.27, code C,

over a nickel underplate in accordance with SAE-AMS2403 (30 to 150 microinches).