MIL-DTL-28748D
3.4.2 Contacts.
3.4.2.1 Removable contacts. Removable contacts shall be qualified to MIL-C-39029. For shipments to the original
equipment manufacturers (OEM), or other suppliers, crimp contact connectors may be supplied without contacts
(see 3.6 and 6.2).
3.4.2.1.1 Pin contacts. Pin contacts shall be in accordance with MIL-C-39029/34 and MIL-C-39029/36.
3.4.2.1.2 Socket contacts. Sockets contacts shall be in accordance with MIL-C-39029/35 and MIL-C-39029/37.
3.4.2.1.3 Contact retaining clip. The contact retaining clip is furnished as part of the contact, assembled in the location
shown on MIL-C-39029/34, MIL-C-39029/35, MIL-C-39029/36, and MIL-C-39029/37. The design of the clip shall be designed
to allow the contacts of being inserted and removed by the tools shown on MIL-I-81969/18 and MIL-I-81969/20.
3.4.2.2 Nonremovable contacts. Nonremovable contact dimensions shall be as shown on figure 3 and shall meet the applicable
requirements of this specification.
3.4.2.2.1 Contact pin. The contact pin shall be of the round pin type with a 60-degree included angle (conical tip configuration),
allowing for a flat end not in excess of .015 inch (0.381 mm) in diameter for size 20 or larger and .008 inch (0.203 mm) for smaller.
3.4.2.2.2 Socket contact. The socket contact shall have a circular cross-section and shall be machined. The entering end of the
socket contact shall be rounded or chamfered to allow for directing and centering of the entering pin. The socket contact shall
provide the spring action for maintaining the contact pressure between the pin and socket. The contact shall be of the closed entry
design to exclude the entrance of a pin .005 inch (0.127 mm) larger than the allowable maximum diameter of the mating pin.
3.4.2.2.3 Tinning solder cups. Where pretinned solder cups are required, the interior surface of solder cups shall be completely
tinned over 100 percent of the full circle portion and for at least 50 percent of the remainder of the solder well area with solder
conforming to composition Sn60 of EIA J-STD-004. Only fluxes meeting EIA J-STD-006, shall be used, any excess of which shall be
removed. Solder cup terminals shall be so constructed that liquid solder cannot leak through to the front of the socket and prevent
insertion of the pin contact. No excess solder shall be on the exterior of the solder cup.
3.4.2.3 Electrical characteristics. Contacts shall have the electrical characteristics as specified in table I.
TABLE I. Current rating.
Contact
Wire size
Amperes
(AWG)
(max)
Solder
16
16
13
20
20
7.5
22
22
5.0
Crimp
16-16
16
13
16-16
18
10
16-16
20
7.5
16-20
20
7.5
16-20
22
5.0
16-20
24
3.0
20-20
20
7.5
20-20
22
5.0
20-20
24
3.0
7
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