MIL-DTL-3607C
INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
J-STD-004 Soldering Fluxes, Requirements For
J-STD-005 Soldering Pastes, Requirements For
J-STD-006 Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders For
Electronic Soldering Applications, Requirements For
(Applications for copies should be addressed to the institute for Interconnecting and Packaging Electronic
Circuits, 2215 Sanders Road, Northbrook, IL 60062-6135.)
SAE International
SAE-AS8660
- Silicone Compound NATO Code Number S-736.
SAE-AMS-QQ-P-416
- Plating, Cadmium (Electrodeposited).
(Applications for copies should be addressed to the SAE International, 400 Commonwealth Drive,
Warrendale PA, 15086-7511.)
2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict
between the text of this document and the references cited herein (except for related specification
sheets), the text of this document takes precedence. Nothing in this document, however, supersedes
applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance
with the applicable specification sheet. In the event of any conflict between the requirements of this
specification and the specification sheet, the latter shall govern.
3.2 Material. The material shall be as specified herein (see 3.1). However, when a definite material is not
specified, a material shall be used which will enable the connectors to meet the performance
requirements of this specification. Acceptance or approval of any constituent material shall not be
construed as a guaranty of the acceptance of the finished product.
3.2.1 Brass. Brass shall conform ASTM-B36/ B36M, or ASTM-B121/B121M, as applicable.
3.2.2 Ceramic. Unless otherwise specified (see 3.1), parts made of ceramic shall be glazed.
3.2.3 Copper-alloy ingots. Copper-alloy ingots shall conform to ASTM-B30.
3.2.4 Copper-beryllium. Copper beryllium shall conform to ASTM-B194, ASTM-B196/ B196M or ASTM-
B197/ B197M. After machining and forming, parts fabricated of copper beryllium shall be heat-treated to
condition HT.
3.2.5 Insulating and sealing compound. Insulating and sealing compound shall conform to SAE-AS8660.
3.2.6 Lead. Lead shall conform to grade B of QQ-L-201.
3.2.7 Phosphor bronze. Phosphor bronze shall conform to composition A of ASTM-B139/ B139M.
3.2.8 Plating. Metal parts shall be of a corrosion resistant material or be protected to meet the
performance requirements of this specification. The type of finish shall be as follows:
3.2.8.1 Cadmium - F. Cadmium plating in accordance with SAE-AMS-QQ-P-416.
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