MIL-DTL-83503C
4.6.15 Humidity (see 3.5.13). The plug and receptacles shall be tested in accordance with test
procedure EIA-364-31 method II, test condition B. The following details shall apply:
a. Samples: The plugs and receptacles shall be mated and wired, unless otherwise specified
(see 3.1).
b Upon completion of step 6 of the final cycle, the connectors shall be removed from the chamber,
unmated, and surface moisture shall be removed.
c. The following tests shall be performed:
(1) Immediately following removal of surface moisture, the withstanding voltage test specified in
4.6.5.1 (sea level) shall be performed.
(2) Within 1 to 2 hours after removal of surface moisture, the insulation resistance test specified
in 4.6.4 shall be performed.
(3) Contact retention shall be measured as specified in 4.6.10.
d. After the 24-hour conditioning period, the insulation resistance specified in 3.5.2 shall again be
measured.
4.6.16 Mating and unmating forces (see 3.5.14). Mated connectors shall be tested in accordance with
test procedure EIA-364-13. The following details shall apply:
a. Rate of mating and unmating: One to 10 inches (25.4 to 250 mm) per minute.
4.6.17 Durability (see 3.5.15). The connector assemblies shall be subjected to 500 cycles of mating
and unmating at a rate of 600 cycles per hour. Following the test, contact resistance shall be measured
as specified in 4.6.12.
4.6.18 Permeability (when applicable) (see 3.5.16). Unmated connectors and connector assemblies
with metal parts and mounting hardware shall be tested in accordance with test procedure EIA-364-54.
4.6.19 Temperature life (see 3.5.18). The connectors shall be tested in accordance with test procedure
EIA-364-17. The following details and exceptions apply:
a.
Sample preparation: Mated and wired connectors.
b.
c.
Test time condition D.
d.
Measurements after test: Insulation resistance and contact resistance shall be measured as
4.6.20 Solderability (see 3.5.19). The solder tail terminals shall be subject to the testing as specified in
MIL-STD-202, method 208. The following details shall apply:
a. Test samples shall not be cleaned prior to soldering.
b. Twenty percent, but not less than 7 leads of test specimens shall be tested.
c. Examination at 10X magnification.
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