MIL-DTL-83503C
3.3.1 Reference materials, plating, and processes. The materials, plating and processes identified in
this specification have been established to assure that connectors manufactured to this specification will
properly interface to similar industry standard or government specified connectors without problems of
electromechanical contamination to electrical and mechanical interfaces, or unacceptable or excessive
interface surface wear. Manufacturers of connectors supplied to this specification are allowed to use
alternate, recognized industry standard materials, plating, and processes from those specified in 3.3. The
use of alternate materials, plating, or process must be coordinated with the qualifying activity as part of the
qualification process, and must not result in inferior short or long term performance of reliability of
connectors manufactured to this specification. Short or long term reliability problems resulting from the
use of alternate materials, plating, or processes are the responsibility of the supplier.
3.3.1.1 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or
environmentally preferable materials should be used to the maximum extent possible provided that the
material meets or exceeds the operational and maintenance requirements, and promotes economically
advantageous life cycle costs.
3.3.1.2 Pure tin. The use of pure tin is prohibited (see 6.4). The maximum amount of pure tin is 97
percent and the alloy material shall inhibit the growth of tin whiskers.
3.3.2 Body and removable insulator, (when applicable). Unless otherwise specified, the body and
removable insulator, (when applicable) shall be diallylphthalate in accordance with ASTM D5948, type
SIG-F (nylon glass filled, type I grade A); Polyester-Glass filled, type GPT-15F, GPT-20F, GPT-30F in
accordance with MIL-M-24519; Polyester Glass filled, or Polypheylene Sulfide-glass filled, designation
3.3.2.1 Hydrolytic stability. All nonmetallic material shall be hydrolytic reversion resistant in accordance
with ASTM D570.
3.3.3 Contacts. Contact material shall contain one or more of the following:
ASTM B159/B159M.
The contact materials shall meet the applicable requirements as specified herein and as specified in the
individual specification sheets (see 3.1).
3.3.3.1 Electrical contact gold guidelines. Electrical contact gold plating shall be in accordance with
ASTM B488, type II, code C, class 1.27 (50 micro-inches) minimum thickness on the contact mating
surface (see 3.1).
3.3.3.2 Contact underplate. All contact finishes shall have an underplate of nickel in accordance with
SAE-AMS-QQ-N-290 class II, 30 to 150 micro-inches (0.76 to 3.81 µm) thick. Silver shall not be used as
an underplate (see 3.3.1).
NOTE: When contacts have been provided in strip form, the absence of plating in the area where the
contact was removed from the strip is acceptable provided it is in a nonfunctional area and any
corrosion formed as a result of salt spray testing does not creep into the contact mating area.
3.3.3.3 Overall finish. All parts of the contact shall be gold in accordance with ASTM B488, type II,
code C, class 1.27 (50 micro-inches minimum thickness see 3.1).
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