MIL-STD-1130 Connections, Electrical, Solderless WrappedThis standard establishes the requirements to produce mechanically and electrically stable, solderless wrapped, electrical connections made with single, solid, round wire and appropriately designed wrapposts terminals.This standard includes:a. Classes and requirements for solderless wrapped connections. b. Description and requirements for the wire used in making the solderless wrapped connections. c. Description and requirements for the wrappost used in making the solderless wrapped connections.

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MIL-STD-1130C

FIGURE 3. Diagonal dimension.

TABLE II. Wrappost geometry.

Parallelism

Straightness in/in

.025 (nominal)

.022 Min.

.025 (nominal)

.022 Min.

.0355 Max.

.0325 Min.

.002

.005 in/in

.045 (nominal)

.042 Min.

.045 (nominal)

.042 Min.

.066 Max.

.059 Min.

.005

.005 in/in

.030 (nominal)

.027 Min.

.060 (nominal)

.057 Min.

.070 Max.

.063 Min.

.005

.005 in/in

5.2.4 Tip configuration. The tip of the wrappost shall terminate in a radius or bevel to facilitate insertion into the wrapping tool. If the tip of the wrappost terminates in a bevel, the apex of the bevel shall be flat, with no side of the flat exceeding .015 inches (.38 mm) on a .025 inch (.64 mm) square and .020 inches (.51 mm) on a .045 inch (1.14 mm) square and .06 inch (1.52 mm) x .03 (.76 mm) rectangle.

5.2.5 Plating. Wrappost shall be plated in accordance with one of the following:

5.2.5.1 Plating, gold. Gold plating shall be in accordance with MIL-DTL-45204, class 1, over nickel in accordance with SAE-AMS-QQ-N-290. Thickness of nickel plating shall be a minimum of 30 microinches.

5.2.5.2 Plating, tin-lead. Tin-lead plating shall be in accordance with SAE-AMS-P-81728 and shall have a tin composition of 50 to 95 percent. Tin-lead plating thickness shall be .0001 to .0003 inch thick.

5.2.5.3 Caution note. Silver underplating shall not be used in any case.