MIL-DTL-24308G
e.
Classes D, K, and M connectors are for high reliability space applications.
Connector installations should be designed to assure that connectors are mated within the limits specified
f.
in 3.4.5.
6.2 Acquisition requirements. Acquisition documents must specify the following:
a.
Title, number, and date of the specification.
b. Title, number, and date of the applicable specification sheet and the complete PIN (see 3.1)
c. Packaging requirement (see 5.1)
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are,
at the time of award of contract, qualified for inclusion in Qualified Products List QPL No. 24308 whether or not such
products have actually been so listed by that date. The attention of the contractors is called to these requirements,
and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government
tested for qualification in order that they may be eligible to be awarded contracts or orders for the products covered by
this specification. Information pertaining to qualification of products may be obtained from Defense Supply Center
Columbus (DSCC-VQ), Document Control Unit, Columbus, OH 43218-3990 or e mail vqchief@dla.mil. An online
listing of products qualified to this specification may be found in the Qualified Products Database (QPD) at
6.4 Copyright notice. All information disclosed in this specification and related specification sheets and military
standards which are or may be copyrighted by IIT Cannon Electric are reproduced herein with the express permission
of the copyright owner.
6.5 Definitions.
6.5.1 Overall finish. A finish having a specified minimum thickness applied over the entire surface area, such as
barrel plating technique or other nonselective plating techniques, etc.
6.5.2 Localized finish. A finish having a specified minimum thickness applied to a definite area, such as, clad,
inlay, welded dot, selective plating technique, etc.
6.5.3 Gold finish. A finish having an unspecified thickness of gold not requiring a specific thickness.
6.6 Specification sheet selection. Use table XIV to determine desired connector specification sheet from the
features listed.
6.7 Tin whisker growth. The use of alloys with tin content greater than 97 percent may exhibit tin whisker growth
problems after manufacture. Tin whiskers may occur anytime from a day to years after, and can develop under
typical operation conditions on products that use such materials. Conformal coatings applied over top of a whisker-
prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead have shown to inhibit the growth
of tin whiskers.
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