MIL-DTL-25516F
3.4.2 Metal parts. Unless otherwise specified, metals parts, except spring members and hermetically
sealed assemblies shall be a suitable copper alloy such as brass, in accordance with ASTM B16,
ASTM B36, ASTM B121, and ASTM B124.
3.4.2.1 Spring members. Signal carrying spring members shall be manufactured of beryllium copper in
accordance with ASTM B194, ASTM B196, and ASTM B197. Non-signal carrying spring member shall be
manufactured of stainless steel in accordance with ASTM A484, or beryllium copper in accordance with
ASTM B194, ASTM B196, and ASTM B197.
3.4.2.2 Hermetically sealed assemblies. Hermetically sealed assemblies are to be manufactured of
steel in accordance with ASTM A108, or stainless steel in accordance with ASTM A484. Hermetically
sealed assemblies may also be manufactured in a suitable sleeve before soldering into a copper alloy
shell. Pin contacts may be of a ferrous alloy.
3.4.3 Plating.
3.4.3.1 Center contacts. The male pin shall be plated to a minimum gold thickness of 50 micro inches
(1.27µm) in accordance with ASTM B488, type II, code C, class 1.27, over 50 micro inches (1.27µm)
minimum of nickel in accordance with SAE-AMS-QQ-N-290, class 1, measured anywhere along the
mating surface, for all series. The socket contact shall be plated to a minimum of 50 micro inches (1.27
µm) of gold in accordance with ASTM B488, type II, code C, class 1.27, over 50 micro inches (1.27 µm)
minimum of nickel in accordance with SAE-AMS-QQ-N-290, class 1, including the I.D., measured at a
depth of .040 inch minimum. The plating on non-significant surfaces in the I.D. shall be of sufficient
thickness to ensure plating continuity and uniform utility and protection. This plating may consist of an
underplate only. A silver underplate shall not be permitted.
3.4.3.2 Shield clamp. Metal shield clamping mechanisms shall be .0001 inch minimum silver in
accordance with ASTM B700, type II, grade A. A suitable underplate may be used.
3.4.3.3 Outer contact (shell). Outer contacts of all types, shall be .000050 (1.27µm) inch minimum gold
in accordance with ASTM B488, type 3, grade C, class 1.27, over a suitable underplate, except silver
which shall not be used.
3.4.4 Insulating materials. Insulating materials shall be suitable for the purpose intended.
3.4.5 Fungus-inert materials. Materials which are not nutrients for fungus shall be used as specified in
method 508.5 of MIL-STD-810 or ASTM G21.
3.4.6 Solder. Soft solder shall be in accordance with J-STD-006.
3.4.7 Flux. Flux, used to facilitate silver soldering, shall be in accordance with O-F-499.
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