8 inch printed wiring boards, and for interconnections between printed wiring boards. The connectors are intended to provide a reliable connection between printed wiring and conventional wiring. The interconnector concept is intended to provide connection of printed wiring on one board to printed wiring on another board.

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MIL-DTL-21097G

4.6.22 Resistance to solvents (see 3.27). Connectors shall be tested in accordance with test procedure EIA-364-11.

The solvents shall be as specified in group 1. The connector tested shall be fully assembled by normal assembly

operations.

5. PACKAGING

5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order

(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel

need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are

maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or within

the Military Service's System Commands. Packaging data retrieval is available from the managing Military Department

or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.

6. NOTES

(This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.)

6.1 Intended use. These are one piece PWB connectors and do not meet the requirements of two piece PWB

connectors as specified in IPC-D275. These connectors are intended to terminate directly to the PWB and are intended

for use in, ground support and shipboard electrical and electronic equipment.

6.2 Acquisition requirements. Acquisition documents should specify the following:

a. Title, number, and date of this specification.

b. Title, number, and date of the applicable specification sheet, and the complete PIN (see 1.3).

c. Packaging requirements (see 5.1).

6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at

the time of award of contract, qualified for inclusion in QPL No.21097, whether or not such products have actually been

so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to

arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that

they may be eligible to be awarded contracts or orders for the products covered by this specification. Information

pertaining to qualification of products may be obtained from the Defense Supply Center Columbus (DSCC-VQ),

Document Control Unit, Columbus, OH 43218-3990 or email: vqp.chief@dla.mil .

6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker

growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can

develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of

a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead have shown to inhibit the

growth of tin whiskers. For additional information on this matter, refer to ASTM B545 (Standard Specification for

Electrodeposited Coatings of Tin).

6.5 Subject term (keyword) listing.

Contacts

Crimp

Eyelet

Plug

Receptacle

Solder

Straight thru

Wrappost