MIL-DTL-83505B
4.6.7 Terminal strength (see 3.5.5).
4.6.7.1 Bend test (type I only). The socket shall be secured to the mounting board by its normal means and then tested in
accordance with method 211, test condition C, of MIL-STD-202, with a test load of 1 pound (453.6 grams) minimum. The bend shall
be only 30° each side of center.
4.6.7.2 Torque test (type I only). Sockets shall be tested in accordance with method 211, test condition E, of MIL-STD-202, with
2 ozf in (14.12 mN m) torque.
4.6.8 Vibration (see 3.5.6) (see figures 7 and 8). Sockets shall be tested in accordance with method 2005 of MIL-STD-1344, the
following details shall apply:
a. Test condition: III.
b. Preparation: Mated with a dummy test circuit (see figure 7 for setup).
c. At the conclusion of the test, the low-signal level contact resistance circuit shall be measured in accordance with 4.6.6 and
the contact withdrawal force shall be measured in accordance with 4.6.4.
d. Low-signal level contact resistance shall not exceed 30 milliohms.
SOCKET UNDER TEST
SOCKETS TO BE SECURED TO
RESPECTIVE SHOCK OR
VIBRATION FIXTURE OR
PRINTED CIRCUIT BOARD AS
APPLICABLE
SOLDER JOINT OR WELD TYP
ALL CONNECTIONS, CONTACTS
WIRED IN SERIES TO
ESTABLISH SERIES CIRCUIT
DC POWER SUPPLY AND
MONITORING EQUIPMENT
CIRCUIT WIRED IN SERIES
FIGURE 8. Vibration and mechanical shock test setup type I through V socket.
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