MIL-DTL-83505B
4.6.9 Mechanical shock (see 3.5.7) (see figures 7 and 8). The socket shall be tested in accordance with method 2004 of MIL-
STD-1344. The following details shall apply:
a. Mounting method and accessories: Mounted by normal means and suitable monitoring circuit to detect any interruption
greater than 1 microsecond.
b. Test condition letter: G.
c. Number of blows: One blow in both directions along each of three mutually perpendicular axes for a total of six shocks.
d. Preparation: Mated with a dummy test circuit (see figure 7 for setup).
4.6.10 Socket durability (see 3.5.8). Each unit shall be subjected to 50 mating and unmating cycles using the maximum test gage
(see figure 5). At the conclusion of the test, the low-signal level contact resistance shall be measured in accordance with 4.6.6 and
the contact withdrawal force shall be measured in accordance with 4.6.4.
4.6.11 Thermal shock (see 3.5.9). Sockets shall be tested in accordance with method 1003 of MIL-STD-1344. The following
details shall apply:
a. For gold contacts: -55°C to +125°C.
b. For tin/lead contact: -40°C to +105°C.
c. Test measurement: The sockets shall be capable of mating and unmating at the temperature extremes (force shall be
unmonitored) during the fifth cycle, without damage to either component.
4.6.12 Corrosive atmosphere (see 3.5.10 and 6.7.1). Mated sockets shall be exposed to a concentrated sulfur atmosphere. The
following details shall apply:
a. Sockets that have been mated with the same minimum gage is used as required for low-signal level contact resistance and
preconditioned by being subjected to two unmonitored insertions of the insertion force gage (see figure 3). The sockets
shall be exposed to a 10-25 PPM solution of ammonium polysulfide at a relative humidity of 60 percent or higher at room
temperature for 4 hours in an enclosed chamber.
b. At the conclusion of the sulfur atmosphere exposure, the low-signal level contact resistance of the undisturbed mated socket
shall be measured in accordance with 4.6.6.
4.6.13 Solderability (except type I and VI terminals) (see 3.5.11). Each terminal shall be subjected to method 208 of
MIL-STD-202.
4.6.14 Resistance to soldering heat (except type I and VI terminals) (see 3.5.12). Sockets shall be tested in accordance with
method 210 of MIL-STD-202. The following details shall apply:
a. Special preparation of specimens: Samples shall be suitably masked to prevent solder from entering the socket. The board
shall be wave or float soldered.
b. Depth of immersion in the molten solder: Sockets shall be immersed to the bottom of the mounting board or panel.
c. Test condition letter: E.
d. Measurements after test: Sockets shall be subjected to the withdrawal force and spring contact retention tests of 4.6.4 and
4.6.15, respectively.
4.6.15 Spring contact retention (see 3.5.13). A 7.5 lbf (31.14 Newton) axial force shall be applied against the spring tines, with the
socket mounted in an appropriate fixture. The direction of the force shall be away from the panel. The termination portion of the
socket sleeve may be removed to permit application of the force.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2).
When the actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible
packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control
Point's packaging activity within the Military Department or Defense Agency, or within the Military Department's System Command.
Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-
ROM products, or by contacting the responsible packaging activity.
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