MIL-DTL-83505B
3.5 Performance.
3.5.1 Insertion force. The maximum insertion force shall be as specified (see 3.1 and 4.6.3). There shall be no damage to the
contact retention member nor shall the contact retention member be displaced from its original location during this test.
3.5.2 Withdrawal force. The spring contact within the socket shall hold the test pin with the .5 ounce (14.2 g) minimum withdrawal
force applied (see 4.6.4).
3.5.3 Socket contact retention (for type I through IV). There shall be no damage or loosening of the socket from the mounting
board after the socket retention test (see 4.6.5).
3.5.3.1 Solderless spring contact printed wiring board (pwb) retention (type VI). There shall be no separation or loosening of the
contact from the test board after the solderless spring contact pwb retention (see 4.6.5.1).
3.5.4 Low-signal level contact resistance circuit. The socket shall show no electrical discontinuity and the contact resistance
requirement shall not be exceeded the values specified in table I (see 4.6.6).
TABLE I. Contact resistance (milliohms).
Initial
After 50 cycles
After corrosive atmosphere
15.0 max
30.0 max
30.0 max
3.5.5 Terminal strength (type I only). Testing of terminals shall not result in damaging of the terminal or the socket contact (see
4.6.7.1 and 4.6.7.2).
3.5.6 Vibration. During vibration, there shall be no interruption in continuity greater than 1 microsecond of the test circuit, which
incorporates, mated contacts. There shall be no physical or mechanical damage to the mounted socket contacts. After the test, the
sockets shall meet the low-signal level contact resistance requirements of 3.5.4 (see 4.6.8). For type VI solderless spring contacts
M83505/6 a printed circuit board shall be used while following the mounting information on the slash sheet.
3.5.7 Mechanical shock. During the test there shall be no interruption in continuity greater than 1 microsecond of the test circuit
that incorporates mated contacts. There shall be no physical damage to the socket (see 4.6.9). For type VI solderless spring
contacts M83505/6 a printed circuit board shall be used while following the mounting information on the slash sheet.
3.5.8 Socket durability (see 4.6.10). After 50 insertions and removals, sockets shall show no evidence of cracking or breaking.
The socket shall meet the low-signal level contact resistance circuit requirement of 3.5.4 and the contact withdrawal force
requirement of 3.5.2. Note. The maximum test gage shall be used for the cycling and a minimum gage shall be used for the final
measurements.
3.5.9 Thermal shock. There shall be no evidence of physical damage to the socket. The socket shall be capable of being mated
with the maximum test gage without damage to the socket or the gage (see 4.6.11).
3.5.10 Corrosive atmosphere. There shall be no evidence of porous plating or exposure of base metal on the contacting surfaces
and the low-signal level contact resistance requirement of 3.5.4 shall not be exceeded (see 4.6.12 and 6.7.1).
3.5.11 Solderability (except type I and VI terminals). Terminations shall withstand the test (see 4.6.13).
3.5.12 Resistance to soldering heat (except type I and VI terminals). Sockets shall withstand the test without damage. There
shall be no solder wicking into the lead engagement area (see 4.6.14). After the test sockets shall meet the withdrawal force
requirement of 3.5.2 and the spring contact retention requirement of 3.5.13.
3.5.13 Spring contact retention. During testing, the spring contact shall not separate from the socket sleeve (see 4.6.15).
3.6 Marking. Sockets shall be marked in accordance with method I of MIL-STD-1285, and shall include the military PIN (see 3.1),
the manufacturer's name or code symbol, and date code.
3.7 Workmanship. Sockets shall be free from burrs, crazing, cracks, voids, pimples, chips, blisters, pinholes and sharp cutting
edges, except type I solderless wrap requires sharp edges on terminal, and other defects that will adversely affect life, serviceability,
or appearance.
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