MIL-DTL-83513G
4.5.10 Temperature cycling. Unmated connectors shall be tested in accordance with test procedure
EIA-364-32, condition I, 5 cycles, except that the maximum temperature shall be 125C +3C, -0C. At
the completion of the last cycle, the connectors shall be returned to room temperature for further
examination and shall meet the requirements specified in 3.5.8.
4.5.11 Humidity. The connectors shall be fully wired and mated. Then the connectors shall be
subjected to testing in accordance with test procedure EIA-364-31, method IV (except steps 7a and 7b
shall not be required). The following exceptions and details specified in 3.5.9 shall apply:
a. After the 24-hour conditioning period, the insulation resistance shall be measured as specified in
b. Upon completion of step 6 of the final cycle, connectors shall be removed from the chamber,
unmated, and surface moisture removed from the inserts. Dielectric withstanding voltage test
specified in 4.5.6.1 (sea level) and insulation resistance test specified in 4.5.7 shall be performed
for all classes of connectors within 1 to 2 hours.
4.5.12 Resistance to soldering heat (see 3.5.10). All solder cup termination type connectors shall be
tested as follows:
a. Unless otherwise specified, the applicable copper wire size 2 to 4 inches in length, properly
prepared for the applicable solder cup size shall be inserted into the contact termination. Seven
contacts or 20 percent of the contacts, whichever is greater, shall be tested.
b. The test specimens shall be fluxed (see 3.5.20) accordingly with liquid or other techniques.
Unless otherwise specified, a pencil type solder iron rated for 25 watts shall be used.
c.
d. The solder iron shall be heated to a temperature of 360C 10C and shall be applied along with
SN-63 solder to the termination for a time duration allowing the solder to become liquid and
remain in the liquid state for 4 to 5 seconds.
e. After application, the soldering iron shall be removed and a visual and mechanical inspection
performed. The visual inspection shall be at 10X.
The connector shall show no evidence of distortion or damage to any area of the connector
f.
housing or evidence of contact misalignment.
4.5.13 Solderability (see 3.5.11).
a. Connectors with wire terminations (A-A-59551) shall be tested for solderability in accordance with
MIL-STD-202, method 208.
b. Connectors with wire cup termination shall be tested for solderability using the following methods.
(1) Test samples shall not be cleaned prior to soldering.
(2) Test sample connectors shall have the solder cups dipped in, or brushed with, flux type RMA
just prior to the application of solder.
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