MIL-DTL-83513G
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not
mandatory.)
6.1 Intended use. These connectors are intended for use in airborne, ground support, and shipboard
electrical and electronic equipment in nonenvironmental resisting applications where the operating
temperature ranges from -55C to +125C. These connectors are not intended for use in blind mating
rack and panel applications.
6.1.1 Class M connectors. Class M connectors may be used in applications where some exposure to
high humidity is experienced.
6.1.2 Class P connectors. Class P connectors are intended for use in low humidity controlled
environments such as telecommunications, computers, sealed enclosures, etc.
6.1.3 Space application. Electroless nickel is intended to be used in space applications. Cadmium is
not to be used in space applications.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of this specification.
b. Title, number, and date of the applicable specification sheet and the complete PIN (see 3.1).
6.3 Qualification. With respect to products requiring qualification, awards will be made only for
products which are, at the time of award of contract, qualified for inclusion in Qualified Product List QPL
No.83513 whether or not such products have actually been so listed by that date. The attention of the
contractors is called to these requirements, and manufacturers are urged to arrange to have the products
that they propose to offer to the Federal Government tested for qualification in order that they may be
eligible to be awarded contracts or orders for the products covered by this specification. Information
pertaining to qualification of products may be obtained from the Defense Supply Center Columbus,
DSCC-VQ, 3990 East Broad Street, Columbus, Ohio 43218-3990. An online listing of products qualified
to this specification may be found in the Qualified Products Database (QPD) at https://assist.daps.dla.mil.
6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent may exhibit tin
whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after,
and can develop under typical operation conditions on products that use such materials. Conformal
coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys
of 3 percent lead have shown to inhibit the growth of tin whiskers.
6.5 Subject term (key word) listing.
Arrangement
Contacts
Dielectric
Engagement
Force
Hardware
Inserts
Insulation resistance
Materials
Metals
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