MIL-DTL-83502E
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not
mandatory.)
6.1 Intended use. The sockets covered by this specification are intended for use on a printed circuit
board or mounting into chassis. Terminals may be soldered to the printed circuit board unless otherwise
noted (see 3.1). Only plug-in component leads with similar finishes to the mating socket contacts should
be mated, reference MIL-HDBK-454, General Guidelines for Electronic Equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of this specification.
b. PIN see 1.2.
c.
Quantity required.
d. First article inspection waiver.
e. Name and address of the first article inspection test facility to which first article samples (if
required) are to be forwarded and the name and address of the Government activity responsible
for conducting the first article inspection program.
6.3 First article. The contracting officer should include specific instructions in acquisition documents
regarding arrangements for examinations, approval of first article test results, and disposition of first
articles. Invitations for bids should provide that the Government reserves the right to waive the
requirement for samples for first article inspection to those bidders offering a product which has been
previously acquired or tested by the Government, and that bidders offering such products, who wish to rely
on such production or test, must furnish evidence with the bid that prior Government approval is presently
appropriate for the pending contract.
6.4 Tin whisker growth. The use of pure tin may exhibit tin whisker growth problems (days to months to
years) after manufacture. Tin whiskers can develop under typical operating conditions on any product
type that uses lead-free pure tin coatings. Conformal coatings applied over top of a whisker-prone surface
will not prevent the formation of tin whiskers. Alloys of 3 percent lead have shown to inhibit the growth of
tin whiskers.
6.5 Definition.
6.5.1 Corrosive atmosphere. The corrosive atmosphere test is intended to reveal imperfections in the
plated contacting surfaces such as pores, scratches, or incomplete plating coverage. It will also reveal
defects such as low contact pressure. However, it is not intended to correlate directly with long term
atmospheric contamination.
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