MIL-DTL-83502E
3.3.4.3 Contact mating area. The contact mating area shall be gold in accordance with ASTM B488,
type II, code C, class 0.76 (30 microinches) minimum, over a nickel underplate in accordance with
SAE-AMS-QQ-N-290, class 2, 50 microinches (1.25 μm) to 150 microinches (3.81 μm) thick. Silver shall
not be used as an underplate (see 3.3.1).
3.3.4.4 Terminations. Terminations shall be plated with gold in accordance with ASTM B488, type II,
code C, class 0.51 (20 microinches) minimum tin-lead in accordance with SAE-AMS-P-81728, .001 inch
(25.4 μm) minimum, over nickel (see 3.3.1). The following conditions shall apply:
a. Type II termination: Tin-lead shall be 50 to 70 percent tin.
b. Types III and IV terminations: Tin-lead shall be 50 to 95 percent tin.
3.3.4.5 Tinning solder cups. Where pretinned solder cups are required, the interior surface of solder
cups shall be completely tinned over 100 percent of the full circle portion and for at least 50 percent of the
remainder of the solder well area with solder conforming to composition Sn60 of J-STD-006. Only fluxes
meeting J-STD-004, shall be used, any excess of which shall be removed. Solder cup terminals shall be
so constructed that liquid solder cannot leak through to the front of the socket and prevent insertion of the
pin. No excess solder shall be on the exterior of the solder cup.
3.4. Fungus. Materials used in the construction of these sockets shall be fungus inert and shall be
capable of meeting the fungus resistant testing of MIL-STD-810, method 508.
3.5 Interface and physical construction. Sockets shall be of the interface and physical construction
specified (see 3.1). The socket assembly consists of the socket insulator body, a socket spring contact
member, and a socket sleeve. The entry to the socket contact shall be beveled, chamfered, or tapered to
facilitate the engagement of the component lead into the socket. The sleeve shall be machined one-piece
construction. The socket termination shall be part of the sleeve member. Part or Identifying Number (PIN)
applicable to tin/lead finished sleeves shall have a temperature rating of -40°C to +105°C. PIN's
applicable to gold finished spring contacts and gold finished sleeves shall have a temperature rating of
-55°C to +125°C.
SOCKET BODY
TYPE IV SOLDER-CUP
TYPE III WIRE
TYPE I WRAPPOST
TURRENT
TYPE II PRINTED
CIRCUIT
FIGURE 1. Terminal type configurations.
3.5.1 Wire terminations. The form factor and dimensions of wire terminations shall be as specified (see
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